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E2C0036-39-12 Semiconductor
Semiconductor MSM9202-XX
GENERAL DESCRIPTION
This version: Feb. 1999 MSM9202-XX
5 7 Dot Character 16-Digit Display Controller/Driver with Character RAM
The MSM9202-XX is a dot matrix vacuum fluorescent display tube controller driver IC which displays characters, numerics and symbols. Dot matrix vacuum fluorescent display tube drive signals are generated by serial data sent from a micro-controller. A display system is easily realized by internal ROM and RAM for character display. The MSM9202-XX has low power consumption since it is made by CMOS process technology. -01 is available as a general-purpose code. Custom codes are provided on customer's request.
FEATURES
* Logic power supply and vacuum fluorescent display tube drive power supply (VDD) : 3.3 V10% or 5.0 V10% * Fluorescent display tube drive power supply (VFL) : -20 to -60 V * VFD driver output current (VFD driver output can be connected directly to the fluorescent display tube. No pull-down resistor is required.) - Segment driver (SEG1 to SEG35) : -6 mA (VFL=-60V) - Segment driver (AD1 and AD2) : -15 mA (VFL=-60V) - Grid driver (COM1 to COM16) : -30 mA (VFL=-60V) * General output port output current - Output driver (P1 and P2) : 1 mA (VDD=3.3V10%) 2 mA (VDD=5.0V10%) * Content of display - CGROM 57 dots : 248 types (character data) - CGRAM 57 dots : 8 types (character data) - ADRAM 16 (display digit) 2 bits (symbol data) - DCRAM 16 (display digit) 8 bits (register for character data display) - General output port 2 bits (static operation) * Display control function - Display digit : 9 to 16 digits - Display duty (contrast adjustment) : 8 stages - All lights ON/OFF * 3 interfaces with microcontroller : DA, CS, CP (4 interfaces when RESET is added) * 1-byte instruction execution (excluding data write to RAM) * Built-in oscillation circuit (external R and C) * Package options: 64-pin plastic QFP (QFP64-P-1414-0.80-BK) (Product name : MSM9202-XXGS-BK) 64-pin plastic SSOP (SSOP64-P-525-0.80-K) (Product name : MSM9202-XXGS-K) xx indicates the code number.
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MSM9202-XX
BLOCK DIAGRAM
VDD GND VFL DCRAM 16w8b CGROM 248w35b Segment Driver RESET DA CP CS 8bit Shift Register CGRAM 8w35b SEG35 AD1 AD Driver AD2 SEG1
ADRAM 16w2b
Address Selector Command Decoder Control Circuit Write Address Counter Read Address Counter
P1 Port Driver P2 Digit Control Duty Control COM1 Grid Driver COM16
Timing Generator 1 OSC0 OSC1 Oscillator
Timing Generator 2
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MSM9202-XX
INPUT AND OUTPUT CONFIGURATION
Schematic Diagrams of Logic Portion Input and Output Circuits Input Pin
VDD VDD
INPUT
GND
GND
Output Pin
VDD VDD
OUTPUT
GND
GND
Schematic Diagram of Driver Output Circuit
VDD VDD
OUTPUT
VFL
VFL
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Semiconductor
PIN CONFIGURATION (TOP VIEW)
52 RESET
SEG10 SEG11 SEG12 SEG13
SEG14 10 SEG15 11 SEG16 12 SEG17 13 SEG18 14 SEG19 15 SEG20 16

64 SEG4 63 SEG3 62 SEG2 61 SEG1
SEG5 SEG6 SEG7 SEG8 SEG9 1 2 3 4 5 6 7 8 9
MSM9202-XX
51 OSC1
50 OSC0
49 GND
48 VFL 47 COM16 46 COM15 45 COM14 44 COM13 43 COM12 42 COM11 41 COM10 40 COM9 39 COM8 38 COM7 37 COM6 36 COM5 35 COM4 34 COM3 33 COM2
60 AD1
59 AD2
56 VDD
55 DA SEG30 26
SEG21 17
SEG22 18
SEG23 19
SEG24 20
SEG25 21
SEG26 22
SEG27 23
SEG28 24
SEG29 25
SEG31 27
SEG32 28
53 CS
54 CP
58 P2
57 P1
SEG33 29
SEG34 30
SEG35 31
NC: No connection
64-Pin Plastic QFP
COM1 32
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Semiconductor

P1 P2 1 2 3 4 5 6 7 8 9 AD2 AD1 SEG1 SEG2 SEG3 SEG4 SEG5 SEG6 SEG7 SEG8 SEG9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 SEG10 SEG11 SEG12 SEG13 SEG14 SEG15 SEG16 SEG17 SEG18 SEG19 SEG20 SEG21 SEG22 SEG23 SEG24 SEG25 SEG26 SEG27 SEG28 64-Pin Plastic SSOP
MSM9202-XX
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33
VDD DA CP CS RESET OSC1 OSC0 GND VFL COM16 COM15 COM14 COM13 COM12 COM11 COM10 COM9 COM8 COM7 COM6 COM5 COM4 COM3 COM2 COM1 SEG35 SEG34 SEG33 SEG32 SEG31 SEG30 SEG29
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PIN DESCRIPTION
Pin QFP SSOP Symbol Type Connects to Fluorescent tube anode electrode Fluorescent tube grid electrode Fluorescent tube anode electrode LED drive control pins Power supply Microcontroller Microcontroller Microcontroller Description Fluorescent display tube anode electrode drive output. Directly connected to fluorescent display tube and a pull-down resistor is not necessary. IOH>-6 mA Fluorescent display tube grid electrode drive output. Directly connected to fluorescent display tube and a pull-down resistor is not necessary. IOH>-30 mA Fluorescent display tube anode electrode drive output. Directly connected to fluorescent display tube and a pull-down resistor is not necessary. IOH>-15 mA General port output. Output of these pins in static operation, so these pins can drive the LED. VDD-GND are power supplies for internal logic. VDD-VFL are power supplies for driving fluorescent tubes. Apply VFL after VDD is applied. Serial data input (positive logic). Input from LSB. Shift clock input. Serial data is shifted on the rising edge of CP. Chip select input. Serial data transfer is disabled when CS pin is "H" level. Reset input. "Low" initializes all the functions. Initial status is as follows. address "00"H * Address of each RAM Content is undefined * Data of each RAM 16 digits * Display digit 8/16 * Contrast adjusment OFF mode * All lights ON or OFF "Low" level * All outputs RESET C2 R2 (Circuit when R and C are connected externally) See Application Circuit.
1 to 31, 5 to 39 SEG1 to 35 61 to 64
O
32 to 47 40 to 55 COM1 to 16
O
59, 60
3, 4
AD1, AD2
O
57, 58 56 49 48 55 54 53
1, 2 64 57 56 63 62 61
P1, P2 VDD GND VFL DA CP CS
O
--
I I I
52
60
RESET
I
Microcontroller or C 2 , R2
50
58
OSC0
I C 1 , R1
External RC pin for RC oscillation. Connect R and C externally. The RC time constant depends on the VDD voltage used. Set the target oscillation frequency to 2 MHz. OSC0 R1 OSC1 C1 (RC oscillation circuit) See Application Circuit.
51
59
OSC1
O
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MSM9202-XX
ABSOLUTE MAXIMUM RATINGS
Parameter Supply Voltage (1) Supply Voltage (2) Input Voltage Power Dissipation Storage Temperature Symbol VDD VFL VIN PD TSTG IO1 Output Current IO2 IO3 IO4 Condition -- -- -- Ta25C -- COM1 to COM16 AD1, AD2 SEG1 to SEG35 P1, P2 QFP SSOP Rating -0.3 to 6.5 -80 to VDD+0.3 -0.3 to VDD+0.3 541 590 -55 to 150 -40 to 0.0 -20 to 0.0 -10 to 0.0 -4.0 to 4.0 mA Unit V V V mW C
RECOMMENDED OPERATING CONDITIONS-1
When the power supply voltage is 5V (typ.)
Parameter Supply Voltage (1) Supply Voltage (2) High Level Input Voltage Low Level Input Voltage CP Frequency Oscillation Frequency Frame Frequency Operating Temperature Symbol VDD VFL VIH VIL fC fOSC fFR Top Condition -- -- All input pins excluding OSC0 pin -- R1=3.3kW, C1=47pF
DIGIT=1 to 16, R1=3.3kW, C1=47pF
Min. 4.5 -60 -- -- 1.5 183 -40
Typ. 5.0 -- -- -- -- 2.0 244 --
Max. 5.5 -20 -- 0.3VDD 2.0 2.5 305 85
Unit V V V V MHz MHz Hz C
All input pins excluding OSC0 pin 0.7VDD
--
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MSM9202-XX
RECOMMENDED OPERATING CONDITIONS-2
When the power supply voltage is 3.3V (typ.)
Parameter Supply Voltage (1) Supply Voltage (2) High Level Input Voltage Low Level Input Voltage CP Frequency Oscillation Frequency Frame Frequency Operating Temperature Symbol VDD VFL VIH VIL fC fOSC fFR Top Condition -- -- All input pins excluding OSC0 pin -- R1=3.3kW, C1=39pF
DIGIT=1 to 16, R1=3.3kW, C1=39pF
Min. 3.0 -60 -- -- 1.5 183 -40
Typ. 3.3 -- -- -- -- 2.0 244 --
Max. 3.6 -20 -- 0.2VDD 2.0 2.5 305 85
Unit V V V V MHz MHz Hz C
All input pins excluding OSC0 pin 0.8VDD
--
ELECTRICAL CHARACTERISTICS
DC Characteristics-1
(VDD=5.0V10%, VFL=-60V, Ta=-40 to +85C, unless otherwise specified) Parameter High Level Input Voltage Low Level Input Voltage High Level Input Current Low Level Input Current Symbol VIH VIL IIH IIL VOH1 High Level Output Voltage VOH2 VOH3 VOH4 Low Level Output Voltage VOL2 IDD1 Current Consumption IDD2 VDD VOL1 Applied pin CS, CP, DA, RESET CS, CP, DA, RESET CS, CP, DA, RESET CS, CP, DA, RESET COM1 to 16 AD1, AD2 SEG1 to 35 P1, P2 COM1 to 16 AD1, AD2 SEG1 to 35 P1, P2 IOL1=2mA Duty=15/16 fOSC= 2MHz, no load Digit=1 to 16 All output lights ON Duty=8/16 Digit=1 to 9 All output lights OFF -- 3 mA -- 4 mA -- 1.0 V -- -- VFL+1.0 V Condition -- -- VIH=VDD VIL=0.0V IOH1=-30mA IOH2=-15mA IOH3=-6mA IOH4=-2mA Min. 0.7VDD -- -1.0 -1.0 VDD-1.5 VDD-1.5 VDD-1.5 VDD-1.0 Max. -- 0.3VDD 1.0 1.0 -- -- -- -- Unit V V A A V V V V
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Semiconductor DC Characteristics-2
MSM9202-XX
(VDD=3.3V10%, VFL=-60V, Ta=-40 to +85C, unless otherwise specified) Parameter High Level Input Voltage Low Level Input Voltage High Level Input Current Low Level Input Current Symbol VIH VIL IIH IIL VOH1 High Level Output Voltage VOH2 VOH3 VOH4 Low Level Output Voltage VOL2 IDD1 Current Consumption IDD2 VDD VOL1 Applied pin CS, CP, DA, RESET CS, CP, DA, RESET CS, CP, DA, RESET CS, CP, DA, RESET COM1 to 16 AD1, AD2 SEG1 to 35 P1, P2 COM1 to 16 AD1, AD2 SEG1 to 35 P1, P2 IOL1=1mA Duty=15/16 fOSC= 2MHz, no load Digit=1 to 16 All output lights ON Duty=8/16 Digit=1 to 9 All output lights OFF -- 2 mA -- 3 mA -- 1.0 V -- -- VFL+1.0 V Condition -- -- VIH=VDD VIL=0.0V IOH1=-30mA IOH2=-15mA IOH3=-6mA IOH4=-1mA Min. 0.8VDD -- -1.0 -1.0 VDD-1.5 VDD-1.5 VDD-1.5 VDD-1.0 Max. -- 0.2VDD 1.0 1.0 -- -- -- -- Unit V V A A V V V V
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Semiconductor AC Characteristics-1
MSM9202-XX
(VDD=5.0V10%, VFL=-60V, Ta=-40 to +85C, unless otherwise specified) Parameter CP Frequency CP Pulse Width DA Setup Time DA Hold Time CS Setup Time CS Hold Time CS Wait Time Data Processing Time RESET Pulse Width RESET Time DA Wait Time All Output Slew Rate VDD Rise Time VDD Off Time Symbol fC tCW tDS tDH tCSS tCSH tCSW tDOFF tWRES Condition -- -- -- -- -- R1=3.3kW, C1=47pF -- R1=3.3kW, C1=47pF When RESET signal is input from microcontroller etc. externally When RESET signal is input from microcontroller etc. externally R2=1.0kW, C2=0.1mF tRSOFF tR tF tPRZ tPOF Cl=100pF -- tR=20% to 80% tF=80% to 20% Min. -- 250 250 250 250 16 250 8 250 250 -- 250 -- -- -- 5.0 Max. 2.0 -- -- -- -- -- -- -- -- -- 200 -- 2.0 2.0 100 -- Unit MHz ns ns ns ns ms ns ms ns ns ms ns ms ms ms ms
tRSON
When mounted in the unit When mounted in the unit, VDD=0.0V
AC Characteristics-2
(VDD=3.3V10%, VFL=-60V, Ta=-40 to +85C, unless otherwise specified) Parameter CP Frequency CP Pulse Width DA Setup Time DA Hold Time CS Setup Time CS Hold Time CS Wait Time Data Processing Time RESET Pulse Width RESET Time DA Wait Time All Output Slew Rate VDD Rise Time VDD Off Time Symbol fC tCW tDS tDH tCSS tCSH tCSW tDOFF tWRES Condition -- -- -- -- -- R1=3.3kW, C1=39pF -- R1=3.3kW, C1=39pF When RESET signal is input from microcontroller etc. externally When RESET signal is input from microcontroller etc. externally R2=1.0kW, C2=0.1mF tRSOFF tR tF tPRZ tPOF Cl=100pF -- tR=20% to 80% tF=80% to 20% Min. -- 250 250 250 250 16 250 8 250 250 -- 250 -- -- -- 5.0 Max. 2.0 -- -- -- -- -- -- -- -- -- 200 -- 2.0 2.0 100 -- Unit MHz ns ns ns ns ms ns ms ns ns ms ns ms ms ms ms
tRSON
When mounted in the unit When mounted in the unit, VDD=0.0V
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Semiconductor
MSM9202-XX
TIMING DIAGRAM
Symbol VIH VIL VDD=3.3V10% 0.8 VDD 0.2 VDD VDD=5.0V10% 0.7 VDD 0.3 VDD
* Data Timing
tCSS CS fC CP tDS DA VALID VALID tDOFF tDH VALID VALID VIH VIL tCW tCW tCSH VIH VIL
tCSW
VIH VIL
* Reset Timing
0.8 VDD 0.0 V VIH 0.5 VDD VIL VIH VIL
VDD RESET
tPRZ tRSON tRSOFF tPOF
When input externally
tWRES
When external R and C are connected
tRSOFF DA
* Output Timing
=
All outputs
tR
tF
0.8 VDD 0.2 VFL
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MSM9202-XX
* Digit Output Timing (for 16-digit display, at a duty of 15/16)
T=8/ fOSC
Frame cycle t1=1024T Display timing t2=60T Blank timing t3=4T
COM1 COM2 COM3 COM4 COM5 COM6 COM7 COM8 COM9 COM10 COM11 COM12 COM13 COM14 COM15 COM16 AD1, 2 SEG1-35
(t1=4.096 ms when fosc=2.0 MHz) (t2=240 ms when fosc=2.0 MHz) (t3=16 ms when fosc=2.0 MHz)
VDD VFL
VDD VFL
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MSM9202-XX
FUNCTIONAL DESCRIPTION
Commands List
LSB
Command 1 DCRAM data write
1st byte B1 X1 B2 X2 B3 X3 B4 1 B5 0 B6 0
MSB
LSB
2nd byte B1 C1 B2 C2 B3 C3 B4 C4 B5 C5 B6 C6
MSB
B0 X0
B7 0
B0 C0 C0 C1
B7 C7
C5 C10 C15 C20 C25 C30 C6 C11 C16 C21 C26 C31 C7 C12 C17 C22 C27 C32 C8 C13 C18 C23 C28 C33 C9 C14 C19 C24 C29 C34 C1 : : : : : : : : * * * * *
2 CGRAM data write
X0
X1
X2
*
0
1
0
0
C2 C3 C4
* * * * *
*
2nd byte 3rd byte 4th byte 5th byte 6th byte
3 ADRAM data write 5 Display duty set 6 Number of digits set 7 All lights ON/OFF Test mode
X0 D0 K0 L
X1 P2 D1 K1 H
X2 * D2 K2
X3 * * *
1 0 1 0 1
1 0 0 1 1
0 1 1 1 1
0 0 0 0 0
C0
4 General output port set P1
*
Xn Cn Pn Dn Kn H L
*
*
When data is written to RAM (DCRAM, CGRAM, ADRAM) continuously, addresses are internally incremented automatically. Therefore it is not necessary to specify the 1st byte to write RAM data for the 2nd and later bytes. Note: The test mode is used for inspection before shipment. It is not a user function.
Don't care Address specification for each RAM Character code specification for each RAM General output port status specification Display duty specification Number of digits specification All lights ON instruction All lights OFF instruction
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Semiconductor Positional Relationship Between SEGn and ADn (one digit)
MSM9202-XX
C0 AD1 C1 AD2 C0
SEG1
ADRAM written data. Corresponds to 2nd byte C3
SEG4
C1
SEG2
C2
SEG3
C4
SEG5
C5
SEG6
C6
SEG7
C7
SEG8
C8
SEG9
C9
SEG10
C10
SEG11
C11
SEG12
C12
SEG13
C13
SEG14
C14
SEG15
C15
SEG16
C16
SEG17
C17
SEG18
C18
SEG19
C19
SEG20
C20
SEG21
C21
SEG22
C22
SEG23
C23
SEG24
C24
SEG25
C25
SEG26
C26
SEG27
C27
SEG28
C28
SEG29
C29
SEG30
C30
SEG31
C31
SEG32
C32
SEG33
C33
SEG34
C34
SEG35
CGRAM written data. Corresponds to 2nd byte CGRAM written data. Corresponds to 3rd byte CGRAM written data. Corresponds to 4th byte
CGRAM written data. Corresponds to 6th byte CGRAM written data. Corresponds to 5th byte
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Semiconductor Data Transfer Method and Command Write Method Display control command and data are written by an 8-bit serial transfer. Write timing is shown in the figure below.
MSM9202-XX
Setting the CS pin to "Low" level enables a data transfer. Data is 8 bits and is sequentially input into the DA pin from LSB (LSB first). As shown in the figure below, data is read by the shift register at the rising edge of the shift clock, which is input into the CP pin. If 8-bit data is input, internal load signals are automatically generated and data is written to each register and RAM. Therefore it is not necessary to input load signals from the outside. Setting the CS pin to "High" disables data transfer. Data input from the point when the CS pin changes from "High" to "Low" is recognized in 8-bit units.
CS CP tDOFF tCSH
DA
B0 B1 B2 B3 B4 B5 B6 B7 LSB 1st byte MSB
B0 B1 B2 B3 B4 B5 B6 B7 LSB 2nd byte MSB
B0 B1 B2 B3 B4 B5 B6 B7 LSB 2nd byte MSB
When data is written to DCRAM* Command and address data
Character code data
Character code data of the next address
*
When data is written to RAM (DCRAM, ADRAM, CGRAM) continuously, addresses are internally incremented automatically. Therefore it is not necessary to specify the 1st byte to write RAM data for the 2nd and later bytes.
Reset Function Reset is executed when the RESET pin is set to "L", (when turning power on, for example) and initializes all functions. Initial status is as follows. * Address of each RAM .................. address "00"H * Data of each RAM ........................ All contents are undefined * General output port ..................... All general output ports go "Low" * Display digit .................................. 16 digits * Contrast adjustment ..................... 8/16 * All display lights ON or OFF ..... OFF mode * Segment output ............................ All segment outputs go "Low" * AD output ..................................... All AD outputs go "Low" Please set again according to "Setting Flowchart" after reset.
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Semiconductor Description of Commands and Functions
MSM9202-XX
1. DCRAM data write (Specifies the address of DCRAM and writes the character code of CGROM and CGRAM.) DCRAM (Data Control RAM) has a 4-bit address to store character code of CGROM and CGRAM. The character code specified by DCRAM is converted to a 57 dot matrix character pattern via CGROM or CGRAM. (The DCRAM can store 16 characters.) [Command format]
LSB MSB
B0 B1 B2 B3 B4 B5 B6 B7 1st byte (1st) X0 X1 X2 X3
LSB
1
0
0
0
MSB
: selects DCRAM data write mode and specifies DCRAM address (Ex: Specifies DCRAM address 0H) : specifies character code of CGROM and CGRAM (written into DCRAM address 0H)
B0 B1 B2 B3 B4 B5 B6 B7 2nd byte (2nd) C0 C1 C2 C3 C4 C5 C6 C7
To specify the character code of CGROM and CGRAM continuously to the next address, specify only character code as follows. The addresses of DCRAM are automatically incremented. Specification of an address is unnecessary.
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Semiconductor
MSM9202-XX
LSB
MSB
B0 B1 B2 B3 B4 B5 B6 B7 2nd byte (3rd) C0 C1 C2 C3 C4 C5 C6 C7
LSB MSB
: specifies character code of CGROM and CGRAM (written into DCRAM address 1H)
B0 B1 B2 B3 B4 B5 B6 B7 2nd byte (4th) C0 C1 C2 C3 C4 C5 C6 C7 : specifies character code of CGROM and CGRAM (written into DCRAM address 2H)
LSB
MSB
B0 B1 B2 B3 B4 B5 B6 B7 2nd byte (17th) C0 C1 C2 C3 C4 C5 C6 C7
LSB MSB
: specifies character code of CGROM and CGRAM (written into DCRAM address FH)
B0 B1 B2 B3 B4 B5 B6 B7 2nd byte (18th) C0 C1 C2 C3 C4 C5 C6 C7 : specifies character code of CGROM and CGRAM (DCRAM address 0H is rewritten)
X0 (LSB) to X3 (MSB): DCRAM addresses (4 bits: 16 characters) C0 (LSB) to C7 (MSB): Character code of CGROM and CGRAM (8 bits: 256 characters) [COM positions and set DCRAM addresses]
HEX X0 X1 X2 X3 0 1 2 3 4 5 6 7 8 9 A B C D E F 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 0 1 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1
COM position COM1 COM2 COM3 COM4 COM5 COM6 COM7 COM8 COM9 COM10 COM11 COM12 COM13 COM14 COM15 COM16
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Semiconductor 2. CGRAM data write (Specifies the addresses of CGRAM and writes character pattern data.)
MSM9202-XX
CGRAM (Character Generator RAM) has a 3-bit address to store 57 dot matrix character patterns. A character pattern stored in CGRAM can be displayed by specifying the character code (address) by DCRAM. The address of CGRAM is assigned to 00H to 07H. (All the other addresses are the CGROM addresses.) (The CGRAM can store 8 types of character patterns.) [Command format]
LSB MSB
B0 B1 B2 B3 B4 B5 B6 B7 1st byte (1st) X0 X1 X2
LSB
*
0
1
0
0
MSB
: selects CGRAM data write mode and specifies CGRAM address. (Ex: specifies CGRAM address 00H) : specifies 1st column data (rewritten into CGRAM address 00H)
B0 B1 B2 B3 B4 B5 B6 B7 2nd byte (2nd) C0 C5 C10 C15 C20 C25 C30
LSB
*
MSB
B0 B1 B2 B3 B4 B5 B6 B7 3rd byte (3rd) C1 C6 C11 C16 C21 C26 C31
LSB
*
MSB
: specifies 2nd column data (rewritten into CGRAM address 00H)
B0 B1 B2 B3 B4 B5 B6 B7 4th byte (4th) C2 C7 C12 C17 C22 C27 C32
LSB
*
MSB
: specifies 3rd column data (rewritten into CGRAM address 00H)
B0 B1 B2 B3 B4 B5 B6 B7 5th byte (5th) C3 C8 C13 C18 C23 C28 C33
LSB
*
MSB
: specifies 4th column data (rewritten into CGRAM address 00H)
B0 B1 B2 B3 B4 B5 B6 B7 6th byte (6th) C4 C9 C14 C19 C24 C29 C34
*
: specifies 5th column data (rewritten into CGRAM address 00H)
To specify character pattern data continuously to the next address, specify only character pattern data as follows. The addresses of CGRAM are automatically incremented. Specification of an address is therefore unnecessary. The 2nd to 6th byte (character pattern data) are regarded as one data item, so 300 ns is sufficient for tDOFF time between bytes.
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Semiconductor
MSM9202-XX
LSB
MSB
B0 B1 B2 B3 B4 B5 B6 B7 2nd byte (7th) C0 C5 C10 C15 C20 C25 C30
LSB
*
MSB
: specifies 1st column data (rewritten into CGRAM address 01H)
B0 B1 B2 B3 B4 B5 B6 B7 6th byte (11th) C4 C9 C14 C19 C24 C29 C34
*
: specifies 5th column data (rewritten into CGRAM address 01H)
X0 (LSB) to X2 (MSB): CGRAM addresses (3 bits: 8 characters) C0 (LSB) to C34 (MSB) : Character pattern data (35 bits: 35 outputs per digit) * : Don't care [CGROM addresses and set CGRAM addresses] Refer to ROMCODE table
HEX X0 X1 X2 00 01 02 03 04 05 06 07 0 1 0 1 0 1 0 1 0 0 1 1 0 0 1 1 0 0 0 0 1 1 1 1
CGROM address RAM00(00000000B) RAM01(00000001B) RAM02(00000010B) RAM03(00000011B) RAM04(00000100B) RAM05(00000101B) RAM06(00000110B) RAM07(00000111B)
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Semiconductor
MSM9202-XX
Positional relationship between the output area of CGROM and that of CGRAM
C0 C5 C10 C15 C20 C25 C30 area that corresponds to 2nd byte (1st column) area that corresponds to 3rd byte (2nd column) C1 C6 C11 C16 C21 C26 C31 C2 C7 C12 C17 C22 C27 C32 C3 C8 C13 C18 C23 C28 C33 C4 C9 C14 C19 C24 C29 C34 area that corresponds to 6th byte (5th column) area that corresponds to 5th byte (4th column) area that corresponds to 4th byte (3rd column)
Note: CGROM (Character Generator ROM) has an 8-bit address to generate 57 dot matrix character patterns. CGRAM can store 248 types of character patterns. General-purpose code -01 is available (see ROM CODE list) and custom codes are provided on customer's request.
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Semiconductor 3. ADRAM data write (specifies address of ADRAM and writes symbol data)
MSM9202-XX
ADRAM (Additional Data RAM) has a 2-bit address to store symbol data. Symbol data specified by ADRAM is directly output without CGROM and CGRAM. (The ADRAM can store 2 types of symbol patterns for each digit.) The terminal to which the contents of ADRAM are output can be used as a cursor. [Command format]
LSB MSB
B0 B1 B2 B3 B4 B5 B6 B7 1st byte (1st) X0 X1 X2 X3
LSB
1
1
0
0
MSB
: selects ADRAM data write mode and specifies ADRAM address (Ex: specifies ADRAM address 0H) : sets symbol data (written into ADRAM address 0H)
B0 B1 B2 B3 B4 B5 B6 B7 2nd byte (2nd) C0 C1 * * * * * *
To specify symbol data continuously to the next address, specify only symbol data as follows. The address of ADRAM is automatically incremented. Specification of addresses is therefore unnecessary.
LSB MSB
B0 B1 B2 B3 B4 B5 B6 B7 2nd byte (3rd) 2nd byte (4th) C0 C1
LSB
*
*
*
*
*
*
MSB
: sets symbol data (written into ADRAM address 1H) : sets symbol data (written into ADRAM address 2H)
B0 B1 B2 B3 B4 B5 B6 B7 C0 C1
LSB
*
*
*
*
*
*
MSB
B0 B1 B2 B3 B4 B5 B6 B7 2nd byte (17th) 2nd byte (18th) C0 C1
LSB
*
*
*
*
*
*
MSB
: sets symbol data (written into ADRAM address FH) : sets symbol data (ADRAM address 0H is rewritten.)
B0 B1 B2 B3 B4 B5 B6 B7 C0 C1 * * * * * *
X0 (LSB) to X3 (MSB) : ADRAM addresses (4 bits: 16 characters) C0 (LSB) to C1 (MSB): Symbol data (2 bits: 2-symbol data per digit) * : Don't care
21/30
Semiconductor [COM positions and ADRAM addresses]
HEX X0 X1 X2 X3 0 1 2 3 4 5 6 7 8 9 A B C D E F 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 0 1 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 COM position COM1 COM2 COM3 COM4 COM5 COM6 COM7 COM8 COM9 COM10 COM11 COM12 COM13 COM14 COM15 COM16
MSM9202-XX
4. General output port set (specifies the general output port status) The general output port is an output for 2-bit static operation. It is used to control other I/O devices and turn on LED. (static operation) When at the "High" level, this output becomes the VDD voltage, and when at the "Low" level, it becomes the ground potential. Therefore, the fluorescent display tube cannot be driven. [Command format]
LSB MSB
B0 B1 B2 B3 B4 B5 B6 B7 1st byte P1 P2 * * 0 0 1 0 : selects a general output port and specifies the output status
P1, P2 : general output port * : don't care [Set data and set state of general output port]
P1 0 1 0 1 P2 0 0 1 1 Display state of general output port Sets P1 and P2 to low Sets P1 to high and P2 to low Sets P1 to low and P2 to high Sets P1 and P2 to high (The state when power is applied or when RESET is input.)
22/30
Semiconductor 5. Display duty set (writes display duty value to duty cycle register)
MSM9202-XX
Display duty adjusts contrast in 8 stages using 3-bit data. When power is turned on or when the RESET signal is input, the duty cycle register value is "0". Always execute this instruction before turning the display on, then set a desired duty value. [Command format]
LSB MSB
B0 B1 B2 B3 B4 B5 B6 B7 1st byte D0 D1 D2 * 1 0 1 0 : selects display duty set mode and sets duty value
D0 (LSB) to D2 (MSB) : display duty data (3 bits: 8 stages) * : don't care [Relation between setup data and controlled COM duty]
HEX 0 1 2 3 4 5 6 7
D0 0 1 0 1 0 1 0 1
D1 0 0 1 1 0 0 1 1
D2 0 0 0 0 1 1 1 1
COM duty 8/16 9/16 10/16 11/16 12/16 13/16 14/16 15/16 (The state when power is turned on or when RESET signal is input.)
23/30
Semiconductor 6. Number of digits set (writes the number of display digits to the display digit register)
MSM9202-XX
The number of digits set can display 9 to 16 digits using 3-bit data. When power is turned on or when a RESET signal is input, the number of digit register value is "0". Always execute this instruction to change the number of digits before turning the dispaly on. [Command format]
LSB MSB
B0 B1 B2 B3 B4 B5 B6 B7 1st byte K0 K1 K2 * 0 1 1 0 : selects the number of digit set mode and specifies the number of digit value
K0 (LSB) to K2 (MSB) : number of digit data (3 bits: 8 digits) * : don't care [Relation between setup data and controlled COM]
HEX 0 1 2 3 4 5 6 7
K0 0 1 0 1 0 1 0 1
K1 0 0 1 1 0 0 1 1
K2 0 0 0 0 1 1 1 1
Number of digits of COM COM1-16 COM1-9 COM1-10 COM1-11 COM1-12 COM1-13 COM1-14 COM1-15 (The state when power is turned on or when RESET signal is input.)
24/30
Semiconductor 7. All display lights ON/OFF set (turns all dispaly lights ON or OFF)
MSM9202-XX
All display lights ON is used primarily for display testing. All display lights OFF is primarily used for display blink and to prevent malfunction when power is turned on. This command cannot control the general output port. [Command format]
LSB MSB
B0 B1 B2 B3 B4 B5 B6 B7 1st byte L H
**
1
1
1
0
: selects all display lights ON or OFF mode
L: sets all lights OFF H: sets all lights ON *: Don't care
[Set data and display state of SEG and AD]
L 0 1 0 1 H 0 0 1 1 Display state of SEG and AD Normal display Sets all outputs to Low Sets all outputs to High Sets all outputs to High (All lights ON mode has priority.) (The state when power is applied or when RESET is input.)
25/30
Semiconductor Setting Flowchart (Power applying included)
Apply VDD
MSM9202-XX
Apply VFL
All display lights OFF
Status of all outputs by RESET signal input
General output port setting
Number of digits setting
Display duty setting Select a RAM to be used
DCRAM Data write mode (with address setting)
Address is automatically incremented
CGRAM Data write mode (with address setting)
Address is automatically incremented
ADRAM Data write mode (with address setting)
Address is automatically incremented
DCRAM Character code DCRAM Is character code write ended?
YES
CGRAM Character code CGRAM Is character code write ended?
YES
ADRAM Character code ADRAM Is character code write ended?
YES
NO
NO
NO
YES
Another RAM to be set?
NO
Releases all display lights OFF mode
Display operation mode
End
26/30
Semiconductor Power-off Flowchart
Display operation mode
MSM9202-XX
Turn off VFL
Turn off VDD
27/30
Semiconductor
MSM9202-XX
APPLICATION CIRCUIT
Heater Transformer 57-dot matrix fluorescent display tube
ANODE ANODE GRID (SEGMENT) (SEGMENT) (DIGIT) VDD R2 VDD C2 VDD C3 Microcontroller Output Port GND CS CP DA GND MSM9202-XX P1, 2 VFL OSC0 OSC1 R1 C1 GND ZD 2 RESET VDD 2 AD1, 2 35 SEG1-35 16 COM1-16 R4 LED NPN Tr GND VDD
VFL
C4
GND
R3
Notes: 1. The VDD value depends on the power supply voltage of the microcontroller used. Adjust the values of the constants R1, R2, R4, C1, and C2 to the power supply voltage used. 2. The VFL value depends on the fluorescent display tube used. Adjust the values of the constants R3 and ZD to the power supply voltage used.
28/30
Semiconductor Reference data
MSM9202-XX
The figure below shows the relationship between the VFL voltage and the output current of each driver. Take care that the total power consumption to be used does not exceed the power dissipation.
VFL Voltage-Output Current of Each Driver (mA) -30 -25
Output Current (mA)
COM1 to COM16 (Condition: VOH=VDD-1.5 V)
-20 -15 -10 -5 0 -10 AD1 and AD2 (Condition: VOH=VDD-1.5 V) SEG1 to SEG35 (Condition: VOH=VDD-1.5 V)
-20
-30
-40
-50
-60 (V)
VFL Voltage (VDD-n)
29/30
Semiconductor
MSM9202-XX
MSM9202-01 ROM Code
00000000B (00H) to 00000111B (07H) are the CGRAM addresses.
MSB 0000 LSB 0000 RAM0 0001 0010 0011 0100 0101 0110 0111 1000 1001 1010 1011 1100 1101 1110 1111
0001 RAM1
0010 RAM2
0011 RAM3
0100 RAM4
0101 RAM5
0110 RAM6
0111 RAM7
1000
1001
1010
1011
1100
1101
1110
1111
30/30
E2Y0002-29-11
NOTICE
1. The information contained herein can change without notice owing to product and/or technical improvements. Before using the product, please make sure that the information being referred to is up-to-date. The outline of action and examples for application circuits described herein have been chosen as an explanation for the standard action and performance of the product. When planning to use the product, please ensure that the external conditions are reflected in the actual circuit, assembly, and program designs. When designing your product, please use our product below the specified maximum ratings and within the specified operating ranges including, but not limited to, operating voltage, power dissipation, and operating temperature. Oki assumes no responsibility or liability whatsoever for any failure or unusual or unexpected operation resulting from misuse, neglect, improper installation, repair, alteration or accident, improper handling, or unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the specified maximum ratings or operation outside the specified operating range. Neither indemnity against nor license of a third party's industrial and intellectual property right, etc. is granted by us in connection with the use of the product and/or the information and drawings contained herein. No responsibility is assumed by us for any infringement of a third party's right which may result from the use thereof. The products listed in this document are intended for use in general electronics equipment for commercial applications (e.g., office automation, communication equipment, measurement equipment, consumer electronics, etc.). These products are not authorized for use in any system or application that requires special or enhanced quality and reliability characteristics nor in any system or application where the failure of such system or application may result in the loss or damage of property, or death or injury to humans. Such applications include, but are not limited to, traffic and automotive equipment, safety devices, aerospace equipment, nuclear power control, medical equipment, and life-support systems. Certain products in this document may need government approval before they can be exported to particular countries. The purchaser assumes the responsibility of determining the legality of export of these products and will take appropriate and necessary steps at their own expense for these. No part of the contents cotained herein may be reprinted or reproduced without our prior permission. MS-DOS is a registered trademark of Microsoft Corporation.
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Copyright 1999 Oki Electric Industry Co., Ltd.
Printed in Japan

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